HuaKun liquid cooling: from server to facility design
Compare cold plate, spray and immersion through node fit, networking, heat rejection, U/OU planning and service procedures.
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HuaKun liquid-cooling infrastructure
Servers, storage nodes, switches and cabinets for cold-plate, spray and immersion cooling. Compatible components, heat rejection and service procedures come together in one design.
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SOFCON AZERBAIJANRequirements / solution / delivery
Models and platforms
| Model | Applications | Key features |
|---|---|---|
| HuaKun HC7000Manufacturer details ↗ | Modular system combining spray cooling, power distribution and environmental monitoring. |
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| HuaKun TG225S B1Manufacturer details ↗ | DDR4 compute node for spray liquid cooling. |
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| HuaKun TG225S B2Manufacturer details ↗ | DDR5 compute node for spray liquid cooling. |
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| HuaKun K121L B1Manufacturer details ↗ | Kunpeng compute node for immersion systems. |
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| HuaKun K221L B1Manufacturer details ↗ | Kunpeng storage node for immersion systems. |
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| HuaKun X121L B1Manufacturer details ↗ | Intel compute node for immersion cooling. |
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| HuaKun X221L B1Manufacturer details ↗ | Intel storage node for immersion cooling. |
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| HuaKun X225L B2Manufacturer details ↗ | Newer-generation Intel immersion storage node with DDR5 memory. |
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| HuaKun AT3518L G4Manufacturer details ↗ | Immersion-cooled AI node with GPU accelerator cards. |
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| CS3900-48T6XManufacturer details ↗ | Management-network switch for immersion infrastructure. |
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| CS5800-48Y8CManufacturer details ↗ | Data-network switch for immersion infrastructure. |
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| KT1211-06SManufacturer details ↗ | Horizontal cabinet integrating a single-phase immersion system. |
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| HuaKun TG125C B2Manufacturer details ↗ | DDR5 Kunpeng rack server with cold-plate cooling. |
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Selection guides
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From requirements to delivery
Three different approaches
TG125C B2 is a cold-plate server. HC7000 and the TG225S family address spray cooling; K/X nodes and compatible switches belong to immersion systems. Each approach brings its own cabinet, connection and service requirements.
Node and cabinet compatibility
The immersion portfolio includes Kunpeng and different Intel Xeon generations. Compute, storage and GPU nodes are designed alongside management and data switches. OU and U remain distinct; mechanical and thermal compatibility is confirmed in the exact system layout.
From heat rejection to service
Facility loops, heat exchangers, power, leak monitoring and fluid-handling procedures inform equipment selection. The SOFCONS brief can also define node removal for service, spare components and safe shutdown tests at acceptance.
Share the facility layout and planned compute load to define the cooling-system scope.